New Espressif Products Coming Soon

The ESP32-PICO-D4 is a System-in-Package (SiP) that is based on ESP32, supporting both Wi-Fi and Bluetooth connectivity, yet avoiding bulky quad-flat no-leads (QFN) packages. The module’s dimensions are only 7.0 × 7.0 × 0.94 mm, which means that it requires minimal PCB area, while integrating a 4 MB SPI flash, a crystal oscillator and most of the decoupling caps. This “makes life a lot easier and reduces via and component count”, as IoTbits acknowledges.

Additionally, ESP32-PICO-D4 integrates peripheral components, such as filter capacitors and RF matching links in a single package. Given that no other peripheral components are involved, module welding and testing are not required either. This way, ESP32-PICO-D4 reduces the complexity of supply chain and improves control efficiency even further. At the core of this module is the ESP32 chip, our flagship dual-core 2.4 GHz Wi-Fi+Bluetooth combo chip, which has been designed with TSMC’s ultra-low-power (40 nm) technology.

With its small size, robust performance and low-energy consumption, ESP32-PICO-D4 is an ideal solution for wearable electronics and other space-constrained applications.

ESP32-PICO-D4 SiP specifications:

• SoC: ESP32 with two Tensilica LX6 cores, 448 KB ROM, 520 KB SRAM (inc. 8 KB RTC memory), 1 kbit eFuse
• On-module Flash: 4 MB SPI flash
• Wi-Fi Connectivity: 802.11 b/g/n/e/i (802.11n up to 150 Mbps)
• Bluetooth Connectivity:
  • Bluetooth V4.2 BR/EDR and Low Energy;
  • class-1, class-2 and class-3 transmitters;
  • Audio: CVSD and SBC
• SD card, UART, SPI, SDIO, LED PWM, Motor PWM, I2S, I2C, IR, GPIO, capacitive touch sensor, ADC, DAC, LNA pre-amplifier
• Sensors: On-chip Hall sensor and temperature sensor
• Clock: On-module 40 MHz crystal
• Power supply: 2.3 to 3.6V
• Operating current: 80 mA (average)
• Temperature range: -40°C to 85°C
• Package dimensions: 7.0±0.1 mm × 7.0±0.1 mm × 0.94±0.1 mm

On a different note, the ESP32-S0WD chip is also a member of the ESP32 series, which has been designed to achieve the best power and RF performance, with robustness, versatility, and reliability in a wide variety of applications. The distinctness of ESP32-S0WD is based on the fact that it features a single core, while maintaining the combination of Wi-Fi and Bluetooth connectivity. 

It is also compatible with all the peripherals of its dual-core 2.4 GHz counterpart that has been designed with TSMC’s ultra-low-power 40nm technology. Available in a 5 × 5 mm QFN package, ESP32-S0WD offers great value for money, as its performance remains solid even when powering complex IoT applications. 

ESP32-S0WD specifications:

• SoC: ESP32 with a single-core, low-power Xtensa 32-bit LX6 microprocessor
• 448 KB of ROM for booting and core functions
• 520 KB of on-chip SRAM for data and instructions
• 16 KB of SRAM in RTC
• QSPI flash/SRAM up to 4 × 16 MB
• Connectivity: Bluetooth (Classic & Low-Energy) + Wi-Fi b/g/n dual mode
• Power supply: 2.3V to 3.6V
• SPI, I2S, I2C, SDIO, UART, IR, PWM
• Temperature sensor, touch sensor, ADC, DAC